Two-Phase Flow Regimes and Heat Transfer Coefficients With R245fa in Manifolded-Microgap Channels

IEEE Transactions on Components, Packaging and Manufacturing Technology(2021)

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摘要
Manifold microchannels have shown high performance in embedded two-phase cooling of high heat flux electronics, demonstrating several examples of heat dissipation of 1 kW from 1-cm2 chips, with low pumping power requirements. The heat transfer coefficients (HTCs) in previous studies of chip-scale manifold-microchannel coolers exhibited a peak at relatively low quality (about 0.2–0.4) an...
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关键词
Heat transfer,Cooling,Liquids,Heating systems,Microchannels,Manifolds,Morphology
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