A Review of Recent Developments in Pumped Two-Phase Cooling Technologies for Electronic Devices
IEEE Transactions on Components, Packaging and Manufacturing Technology(2021)
摘要
In this review, the heat transfer characteristics of several pumped two-phase electronic cooling technologies are quantitatively examined and compared on the basis of heat flux, coolant temperatures, heat source area, base temperature, and coolant type. Cooling by parallel flow in mini/microchannels, pin fins, spray cooling, and jet impingement are discussed in detail. Chip powers up to 2.9 kW and...
更多查看译文
关键词
Cooling,Heat sinks,Heat transfer,Coolants,Heat pumps,Heat engines,Manufacturing
AI 理解论文
溯源树
样例
![](https://originalfileserver.aminer.cn/sys/aminer/pubs/mrt_preview.jpeg)
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要