Experimental Demonstration of Pressure-Driven Flash Boiling for Transient Two-Phase Cooling

IEEE Transactions on Components, Packaging and Manufacturing Technology(2021)

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摘要
This work demonstrates transient cooling for high-heat-flux electronics using pressure-controlled flash boiling. Many advanced electronics packages demand rapid, high-heat flux removal under stringent spatial and temporal constraints such as limited lateral heat spreading area, sharp power delivery transients, and heterogeneous power dissipation among dies. Flash cooling achieved by rapid depressu...
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关键词
Cooling,Heating systems,Transient analysis,Heat transfer,Electronic packaging thermal management,Steady-state,Coolants
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