Numerical analysis of the microscopic factors influencing the thermal conductivity of Al 2 O 3 / AIN polymer composites

The thermal interface materials (TIMs) used between a chip and a heat spreader in electronic packaging composes polymeric materials filled with particulate fillers. In this work, we focus on the numerical modeling and design of the particle-laden polymers with high packing density, in which two kinds of particles are mixed. Specifically, $\mathbf{\mathrm{A}1_{2}\mathrm{O}_{3}}$ and AIN,...