The Formation of Cn-Sn IMC Interconnection by Solid-Liquid Interdiffusion Bonding for 3D Glass Wafer Stacking

Yangquan Su, Kuili Ren,Yiyong Huang,Mingchuan Zhang,Daquan Yu

2021 22nd International Conference on Electronic Packaging Technology (ICEPT)（2021）

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摘要

Wafer bonding technology promotes 3D system integration and packaing. In this paper, the Cu/Sn low-temperature bonding for 3D glass wafer stacking is studied. The effects of temperature, pressure and time on the bonding process are demonstrated by experiments and simulations. The formation of ${\text{Cu}_{3}\text{Sn}}$ is incorporated into Cu/Sn bonding interface. For 5G devices, such a...

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关键词

3D Packaging,multilayer stacked,Cu/Sn bonding,Through Glass Vias(TGVs)

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