Synthesis and properties study of a thermoplastic polyimide with high glass transition temperature for wafer level package

Polyimides (PIs) have been used in a wide spectrum of high-tech fields for their excellent thermal property, excellent mechanical property, extremely low dielectric constant, excellent low temperature resistance, low CTE and good chemical resistance. However, the rigid molecular structure combined with strong intermolecular interaction results in insolubility and low meltability. In this work, the...