Self-heating Effects Measured in Fully Packaged FinFET Devices

A unique, resource efficient method for finding the impact of Self-heating Effects (SHE) in packaged FinFET devices is presented in this work. Device level concerns seen in reliability degradation and system level issues with power dissipation are inspected using separate measuring techniques. We show that a frequency effect observed in reliability is attributed to self-heating of the Fins during ...