Aquabolt-XL: Samsung HBM2-PIM with in-memory processing for ML accelerators and beyond

2021 IEEE Hot Chips 33 Symposium (HCS)(2021)

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摘要
Using PIM to overcome memory bottleneck • Although various bandwidth increase methods have been proposed, it is physically impossible to achieve a breakthrough increase. - Limited by # of PCB wires, # of CPU ball, and thermal constraints • PIM has been proposed to improve performance of bandwidth-intensive workloads and improve energy efficiency by reducing computing-memory data movement.
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关键词
Wires,Memory management,Bandwidth,Energy efficiency
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