A Wideband mmWave Antenna in Fan-Out Wafer Level Packaging With Tall Vertical Interconnects for 5G Wireless Communication

Bin Yu,Zhanyi Qian, Chengchung Lin,Johnson Lin,Yueping Zhang,Guangli Yang,Yong Luo

IEEE Transactions on Antennas and Propagation（2021）

引用 23|浏览17

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摘要

A novel fan-out wafer-level packaging (FOWLP) technology with double-sided redistribution layers (RDLs) and tall copper vertical interconnects is described. The design of a dual-polarized magnetoelectric (ME) dipole antenna based on this new packaging technology is presented. It is shown that the antenna with a size of $10\times10$ 更多

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关键词

Dipole antennas,Antenna measurements,5G mobile communication,Bandwidth,Antenna feeds,Antenna arrays,Wireless communication

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