Selective Barrier for Cu Interconnect Extension in 3nm Node and Beyond

Shi You,He Ren,Mehul Naik,Lu Chen,Feng Chen, Carmen Leal Cervantes, Xiangjing Xie,Keyvan Kashefizadeh

2021 IEEE International Interconnect Technology Conference (IITC)（2021）

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摘要

The continued scaling in logic technology poses significant challenges such as huge resistance-capacitance (RC) delays due to the shrinkage in dimensions. To address the BEOL Cu interconnect portion of RC delays, reducing the via resistance through Tantalum Nitride (TaN) barrier layer adjustment is critical while in the meantime must meet the reliability requirement. TaN barrier on via bottom cont...

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关键词

Resistance,Degradation,Tantalum,Conferences,Conductivity,Delays,Reliability

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