Process Integration of High Aspect Ratio Vias with a Comparison Between Co and Ru Metallizations
V. Vega-Gonzalez,D. Montero,J. Versluijs,O. Varela Pedreira,N. Jourdan,H. Puliyalil,B. Chehab, T. Peissker, A. Haider,D. Batuk,G. T. Martinez,J. Geypen,Q. T. Le,N. Bazzazian,N. Heylen, M. van der Veen,Z. El-Mekki,T. Webers, H. Vats,L. Rynders,M. Cupak,J. Uk-Lee,Y. Drissi, L. Halipre,W. Gillijns,A-L Charley,P. Verdonck,T. Witters, S. Gompel,Y. Kimura,I Ciofi,B. De Wachter,J. Swerts,E. Grieten,M. Ercken,R. Kim,K. Croes,P. Leray,M. Jaysankar,N. Nagesh, L. Ramakers,G. Murdoch,S. Park,Z. Tokei, E. Dentoni-Litta,N. Horiguchi 2021 IEEE International Interconnect Technology Conference (IITC)（2021）
Key words
High-aspect ratio via,Supervia,BEOL,Ru,Co
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