Fabrication and Characterization of ISC embedded Interposer for High Performance Interconnection

Won Ji Park, Min Guk Kang,Jae Hee Oh,Shaofeng Ding,Ji Hyung Kim, Je Gwan Hwang, Yun Ki Choi,Jung Ho Park, Won Hyoung Lee, Seung Ki Nam, Seong Wook Moon, Jong Mil Youn,Jeong Hoon Ahn

2021 IEEE International Interconnect Technology Conference (IITC)（2021）

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摘要

Interposer to interconnect between the electronic components has been developed for the last few decades because it can improve the system performance effectively, compared to the system with intra-chip wiring. In this paper, the integrated stack capacitor (ISC) embedded interposer system was demonstrated with the approximately 8 times higher capacitance (Ci) than interposer with MIM (M...

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关键词

Temperature measurement,Wiring,Resistance,Temperature dependence,System performance,Capacitors,Semiconductor device reliability

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