8 Tbps Co-Packaged FPGA and Silicon Photonics Optical IO
2021 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC)（2021）
摘要
The first 8 Tbps co-packaged FPGA with Silicon-Photonics IO is presented paving the way for co-packaged compute and optical-IO. The Multi-Chip Package integrates Stratix® 10 FPGA with up to five optical IO chiplets. © 2021 The Author(s).
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