A 1.2 kV 400A SiC-MOSFET Based 3L-TNPC Power Module With Improved Hybrid Packaging Method for High-Density Applications

Zhao Yuan,Asif Imran Emon,Si Huang,Zhongjing Wang,Yalin Wang,Mustafeez Hassan,Balaji Narayanasamy,Amol Deshpande,Fang Luo

2021 IEEE Applied Power Electronics Conference and Exposition (APEC)（2021）

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摘要

Three-level T-type neutral-point-clamped converters (3L-TNPC) are widely used in motor drive and PV applications because of the higher efficiency, improved output THD, and lower common-mode noise. But such topology suffers from high stray inductance because of the complicated power loop structure. This paper proposes a SiC-MOSFET based 3L-TNPC power module with a hybrid packaging method. The modul...

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关键词

Inductance,Silicon carbide,Wires,Multichip modules,Logic gates,Thermal conductivity,Electronic packaging thermal management

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