Augmented Silkscreen: Designing AR Interactions for Debugging Printed Circuit Boards

PROCEEDINGS OF THE 2021 ACM DESIGNING INTERACTIVE SYSTEMS CONFERENCE (DIS 2021)(2021)

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摘要
Debugging printed circuit boards (PCBs) requires frequent context switching and spatial pattern matching between software design files and physical boards. To reduce this overhead, we conduct a series of interviews with electrical engineers to understand their workflows, around which we design a set of AR interaction techniques, we call Augmented Silkscreen, to streamline identification, localization, annotation, and measurement tasks. We then run a set of remote user studies with illustrative video sketches and simulated PCB tasks to compare our interactions with current practices, finding that our techniques reduce completion times. Based on these quantitative results, as well as qualitative feedback from our participants, we offer design recommendations for the implementation of these interactions on a future, deployable AR system.
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关键词
Augmented Reality, Printed Circuit Board, Hardware, Debugging
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