Release Process Development for MEMS Micro-Bridge Structure

2021 China Semiconductor Technology International Conference (CSTIC)（2021）

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摘要

In this work, release process was developed for micro-bridge structure based MEMS products. Etch rate of release process for different material on blanket wafer was collected, and optimized thin film stack was obtained according to the data. Dedicated structure and MEMS product were then designed to evaluate the release process. From the physical data measured by 3D profiler, release process can w...

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关键词

Micromechanical devices,Semiconductor device measurement,Three-dimensional displays

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