Development of Metal Bonding for Passive Matrix Micro-LED Display Applications

IEEE Electron Device Letters(2021)

引用 11|浏览1
暂无评分
摘要
Recently, there are many breakthroughs of display in the high resolution and vivid colors for applications in virtual/augmented reality. In this study, we have successfully developed a $64 \times 32$ array inline structure of a micro-LED ( $\mu $ LED) display by metal bonding an LED array with a glass circuit for connecting a passive matrix IC driver. The dimension of each $\mu $ LED was $100\...
更多
查看译文
关键词
Light emitting diodes,Bonding,Glass,Metals,Substrates,Current measurement,Integrated circuits
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要