Electrical Characteristics and Reliability of Wafer-on-Wafer (WOW) Bumpless Through-Silicon Via

Yi-Chieh Tsai,Chia-Hsuan Lee,Hsin-Chi Chang,Jui-Han Liu,Han-Wen Hu,Hiroyuki Ito,Young Suk Kim,Takayuki Ohba,Kuan-Neng Chen

IEEE Transactions on Electron Devices（2021）

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摘要

Electrical characteristics and reliability of the wafer-on-wafer (WOW) bumpless through-silicon via (TSV) structure are investigated, and the new lumped circuit model is proposed to simulate the performance of the structure. Including the actual contact resistance in the model, the integrity of the high-frequency signal can be accurately simulated. For the 12-layer stacked bumpless TSV structure w...

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关键词

Through-silicon vias,Stacking,Cleaning,Resistance,Periodic structures,Propagation losses,Reliability

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