Die-attach Properties of Pressure-sintered Copper Joints on Adhesive Metallization Surfaces in N2 Atmosphere

Die-attach properties of mechanical pressure-assisted sintered copper (pressure-sintered Cu) on some metallization layers in N2 atmosphere for high-power devices were investigated. The shear strength of pressure-sintered Cu on Ag plating increased as the bonding temperatures and bonding pressures increased. On the bonding conditions (2 MPa, 300 °C, 3 min and 60 min), the shear strength of pressure...