WeChat Mini Program
Old Version Features

Electromigration Improvement by Graphene on Cu Wire for Next Generation VLSI

Y. T. Hung, J. Z. Huang,H. H. Chang,K. P. Huang,O. H. Lee, W. L. Chiu, H. J. Jian,K. C. Huang, W. C. Lo,J. S. Hu,C. Wu

International Conference on Electronics Packaging（2021）

Cited 1|Views5
Key words
electromigration,damascene,graphene capping layer,nanotwinned Cu
AI Read Science
Must-Reading Tree
Example
Generate MRT to find the research sequence of this paper
Chat Paper
Summary is being generated by the instructions you defined