MCU and Motor Driver Leaf Modules of Coin-Sized PCBs in an Open-Innovation IoT/CPS Platform

Kenichi Agawa, Tokihiko Mori, Ryoji Ninomiya,Minoru Takizawa,Takayasu Sakurai

2021 International Conference on Electronics Packaging (ICEP)（2021）

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摘要

One trillion IoT nodes will be in use in the 2030s. To realize the rapid penetration, development platforms, where IoT devices are easily prototyped, are required. We present the platform where IoT devices are realized selecting and connecting several single-function PCBs. Moreover, we have developed a 58-pin connection mechanism by rubber connectors and have realized a 32-bit high-performance MCU...

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关键词

Wireless communication,Connectors,Wires,Prototypes,Cameras,Pins,Rubber

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