FinFET Plus: A Scalable FinFET Architecture with 3D Air-Gap and Air-Spacer Toward the 3nm Generation and Beyond

A new improvement of FinFET has been demonstrated in the extension of the Moore’s Law toward N3 technology and beyond. Instead of conventional STI, the approach is to use air-trench-isolation (ATI) between fins such that, in the width direction, inter-fin spaces with air-gap in the active region become scalable. The scalable ATI FinFET exhibits better DC and RF performance. Results show that the p...