Electrical Insulation Design and Accurate Estimation of Temperature via an Electrothermal Model for a 10 kV SiC Power Module Packaging
2020 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP)（2020）
摘要
Wide-bandgap (WBG) power devices can tolerate higher currents and voltages than their silicon (Si)-based counterparts. However, the realization of their superior characteristics is tied to the reliability of their packaging, where thermal management and reliable electrical insulation design are the most challenging tasks to this end. Not taking care of the former one leads to thermal runaway, and ...
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