Immunity to random fluctuations induced by interface trap variability in Si gate-all-around n -nanowire field-effect transistor devices

The impact of variations in the donor and acceptor interface trap distributions on the fluctuation characteristics of 7-nm-node Si gate-all around n -nanowire FET (n-NWFETs) is analyzed in a hardware-calibrated quantum-corrected three-dimensional (3D) drift–diffusion (DD) numerical simulation framework. Shifting the energy position of the peak in the acceptor trap density distribution ( D it ) induces greater surface potential fluctuations and carrier mobility degradation compared with variation of the donor traps. It is found that single-charge traps (SCTs) and random interface traps (RITs) induce larger V _T and drain-induced barrier lowering (DIBL) variations, along with charge neutrality level (CNL) variations induced by interface trap fluctuations. The Si n -NWFET shows better immunity to interface trap variability when the CNL is located between the midgap and the conduction-band edge. For future sub-7-nm high-performance NWFET logic devices, such interface trap variability will be one of the major sources of random fluctuations at the device level.