An in-situ electron backscattering diffraction and viscoplastic self-consistent study of microstructure and texture development in OFHC copper subjected to uniaxial tension

Abstract Electron backscattering diffraction was used in-situ to track microstructure and texture development in polycrystalline copper during uniaxial tension. Characteristic of face-centred-cubic materials, copper develops a double fibre texture comprising a relatively strong 111 fibre and a weak 100 fibre parallel to the tensile axis. The observation of small stacking faults via transmission electron microscopy indicates that partial slip contributes to strain accommodation during uniaxial tension. The visco-plastic self-consistent model was applied to simulate the macroscopic stress-strain curve and crystallographic texture development by considering the effects of the grain-matrix interaction mode, latent hardening, perfect and partial slip. The simulations demonstrate that an intermediate grain-matrix interaction scheme coupled with weak latent hardening, dominant perfect slip and limited partial slip returns the best agreement between the experimental and simulated textures.