HotCluster: A Thermal-Aware Defect Recovery Method for Through-Silicon-Vias Toward Reliable 3-D ICs Systems

Khanh N. Dang,Akram Ben Ahmed,Abderazek Ben Abdallah,Xuan-Tu Tran

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems（2022）

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摘要

Through silicon via (TSV) is considered as the near-future solution to realize low-power and high-performance 3D-integrated circuits (3D-ICs) and 3D-Network-on-Chips (3D-NoCs). However, the lifetime reliability issue of TSV due to its fault sensitivity and the high operating temperature of 3D-ICs, which also accelerates the fault rate, is one of the most critical challenges. Meanwhile, most curren...

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关键词

Through-silicon vias,Reliability,Circuit faults,Redundancy,Integrated circuit reliability,Fault tolerant systems,Cooling

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