Wafer-Scale Encapsulated Saw Temperature and Pressure Sensors for Harsh Environments

Eldwin J. Ng,Jaibir Sharma,Eva Wai Leong Ching,Guoqiang Wu, Didier Pohl, Olivier Vancauwenberghe

2021 IEEE 34th International Conference on Micro Electro Mechanical Systems (MEMS)（2021）

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摘要

Passive SAW sensors do not require circuitry or power and are ideal for harsh environments or rotating machinery. AlN-based thin film SAW resonators for temperature and pressure sensors have been developed in this work using AlGe wafer-scale encapsulation for device protection, pressure reference, high stability, and small size. Temperature and pressure co-testing of both sensors up to 160°C and 60 bar revealed ~1% full-scale accuracy.

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关键词

Surface Acoustic Wave (SAW),Temperature Sensors,Pressure Sensors,Wafer-scale Encapsulation

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