Thermal-mechanical performance analysis and structure optimization of the TSV in 3D IC

Guigen Ye, Zhimin Wang,Xinjian Li,Shifeng Xue,Liang Gong

IEEE Transactions on Components, Packaging and Manufacturing Technology（2021）

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摘要

The through-silicon via (TSV) technology is widely used in 3-D integrated circuit (3-D IC) devices. However, the TSV could cause great thermal stress due to the mismatch of the thermal expansion between different materials, which affects the performance of the 3-D IC. In this work, a finite element model of the 3-D IC device with both internal pin-fin microchannels and all-copper interconnection i...

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关键词

Through-silicon vias,Three-dimensional displays,Integrated circuits,Stress,Strain,Integrated circuit modeling,Pins

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