A Wafer-scale Manufacturing Pathway for Fine-grained Vertical 3D-IC Technology

Sachin Bhat, Sounak Shaun Ghosh,Sourabh Kulkarni,Mingyu Li,Csaba Andras Moritz

2021 22nd International Symposium on Quality Electronic Design (ISQED)（2021）

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摘要

Three-dimensional integrated circuits (3D-ICs) provide a feasible path for scaling CMOS technology in the foreseeable future. IMEC and IRDS roadmaps project that 3D integration is a key avenue for the IC industry beyond 2024. They project that some form of 3D-IC technology based on nanosheets/nanowires is likely to become mainstream soon. SkyBridge-3D-CMOS (S3DC) is one among the first vertical na...

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关键词

Performance evaluation,Semiconductor device modeling,Industries,Solid modeling,Three-dimensional displays,Manufacturing processes,Integrated circuit interconnections

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