Reliability and Variability-Aware DTCO Flow: Demonstration of Projections to N3 FinFET and Nanosheet Technologies

G. Rzepa,M. Karner,O. Baumgartner, G. Strof,F. Schanovsky,F. Mitterbauer, C. Kernstock, H.W. Karner,P. Weckx,G. Hellings, D. Claes,Z. Wu,Y. Xiang,T. Chiarella,B. Parvais,J. Mitard,J. Franco,B. Kaczer,D. Linten,Z. Stanojevic

2021 IEEE International Reliability Physics Symposium (IRPS)（2021）

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摘要

Reliability and variability-aware simulations of logic cells are essential to correctly analyze and predict the performance of upcoming technologies. A simulation flow for DTCO is presented here, which combines the accuracy of TCAD with the performance of SPICE - utilizing parasitic extractions, the impedance field method for variations, and the compact-physics simulator Comphy for reliability. Go...

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关键词

Temperature distribution,Materials reliability,Predictive models,FinFETs,SPICE,Nanoscale devices,Data models

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