Influence of Ball Size and Geometry on the Reliability and RF Performance of mmWave System-in-Package: A Simulation Approach

Seyyid Dilek,Ivan Ndip,Marco Rossi,Christian Tschoban,Simon Kuttler,Olaf Wittler,Klaus-Dieter Lang,Christian Goetze,Daniel Berger,Marcel Wieland,Martin Schneider-Ramelow

2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)（2021）

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摘要

Solder ball reliability is a long-discussed topic in microelectronic packaging. With new package types needed for mmWave applications a trade-off between reliability and RF performance may arise, when the solder ball geometry has to be selected for specific package assemblies. In this work, the lifetime for different solder ball geometries is investigated within a numerical simulation workflow, by...

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关键词

Radio frequency,Geometry,Solid modeling,Three-dimensional displays,Sensitivity analysis,Packaging,Numerical simulation

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