Direct bonding of copper foil and liquid crystal polymer by laser etching and welding

•Laser etching method is proposed to reduce copper foil surface roughness compared with the traditional method.•Laser integrated manufacturing method was used to weld the copper foil and LCP.•Optimum laser parameters were determined to prepare two-layer adhesive-free flexible copper clad laminates.•The effect of laser treating on copper foil and LCP was investigated.•The bonding strength can reach its maximum and peel strength can reach 682.78 N/m.