Evaluation of Laser Releasable Temporary Bonding Adhesives for the Thinned Wafer Integration
2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)（2020）
关键词
device wafer,thermal stability,high vacuum survivability,advanced packaging integration processes,thermal simulation test,bond line,high vacuum conditions,laser ablation,system-in-packaging,package-on-package,heterogeneous integration applications,thinned wafer integration,advanced packaging applications,laser releasable temporary bonding adhesives,PECVD,Ti-Cu,SiO2
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