Optimization of Temporary Wafer Bonding Materials and Processes for 3D IC Integration
2020 15TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT 2020)（2020）
关键词
3D IC integration,3D stacked IC technology,high-end applications,high-integration microelectronics,device processing,carrier wafer,high-performance packages,process integration,manufacturing aspects,temporary wafer bonding process,three-dimensional integrated circuit package,release layer observation,thinned device wafer,wafer bonding defect,plasma active process,plasma active release layers,silicon wafer,corrugated release layer,bonded stack,wafer separating process,3D IC package,temporary wafer bonding materials,FIB observation,SUSS DB12T debonder,time 360.0 s,time 100.0 s,time 100 s
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