Cmos Compatible Process Integration Of Sot-Mram With Heavy-Metal Bi-Layer Bottom Electrode And 10ns Field-Free Sot Switching With Stt Assist

Noriyuki Sato,Gary A. Allen, William P. Benson, Benjamin Buford, Atreyee Chakraborty,Michael Christenson,Tanay A. Gosavi, Philip E. Heil,Nafees A. Kabirl, Brian J. Kristl,Kevin P. O'Brien,Kaan Oguz, Rohan R. Patil, James Pellegren,Angeline K. Smith,Emily S. Walker,Patrick J. Hentges,Matthew V. Metz, Mansi Seth, Bob Turkot,Christopher J. Wiegand,Hui Jae Yoo,Ian A. Young

2020 IEEE SYMPOSIUM ON VLSI TECHNOLOGY(2020)

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摘要
This paper demonstrates a CMOS compatible process integration of spin-orbit torque (SOT) device with a unique bilayer SOT bottom electrode. An effective spin-Hall angle of 0.27, a median tunneling magneto-resistance ratio of 127% at electrical CD of 57 nm, and a 96% resistance-based MTJ yield on 300 mm scale were achieved. We experimentally validated the two-pulse field-free SOT switching scheme with spintransfer torque assist at 10 ns. Unlike conventional field-free SOT switching schemes, the demonstrated scheme adds no complexity to process integration.
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关键词
unique bilayer SOT bottom electrode,effective spin-Hall,median tunneling magneto-resistance ratio,two-pulse field-free SOT switching scheme,spin-transfer torque,CMOS compatible process integration,SOT-MRAM,STT assist,heavy-metal bi-layer bottom electrode,conventional field-free SOT switching
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