High-sigma analysis of DRAM write and retention performance: a TCAD-to-SPICE approach

2020 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)(2020)

引用 4|浏览33
暂无评分
摘要
This paper presents a TCAD-to-SPICE high-sigma analysis of DRAM write and retention performance. Both statistical and process-induced variability are taken into- account. We highlight that the interplay between discrete traps and discrete dopants is ruling the leakage statistical tails and therefore can play a fundamental role in determining yield and reliability of ultra-scaled DRAMs.
更多
查看译文
关键词
DRAM,leakage,retention time,DTCO,TCAD
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要