Wafer-level Vacuum Packaging of a MEMS Resonator Using the Three-layer Bonding Technique

Chung Mo Yang,Hee Yeoun Kim,Jong Cheol Park, Ye Eun Na, Tae Hyun Kim, Kil Son Noh, Gap Seop Sim,Ki Hoon Kim

JOURNAL OF SENSOR SCIENCE AND TECHNOLOGY（2020）

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