Validation of Thermal Stress Modeling in PV Inverters under Mission Profile Operation

2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe)(2020)

引用 0|浏览6
暂无评分
摘要
This paper quantifies the accuracy of thermal stress modeling in PV inverters under real mission profile operation. The estimated thermal stress profiles obtained from a lumped thermal network under one-day mission profiles are compared with the experimental measurement. According to the results, the average estimation error is well below 1.5 % even under highly dynamics mission profile conditions.
更多
查看译文
关键词
Reliability,Mission profile,Photovoltaic,Power semiconductor device,Thermal stress
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要