Validation of Thermal Stress Modeling in PV Inverters under Mission Profile Operation
2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe)(2020)
摘要
This paper quantifies the accuracy of thermal stress modeling in PV inverters under real mission profile operation. The estimated thermal stress profiles obtained from a lumped thermal network under one-day mission profiles are compared with the experimental measurement. According to the results, the average estimation error is well below 1.5 % even under highly dynamics mission profile conditions.
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关键词
Reliability,Mission profile,Photovoltaic,Power semiconductor device,Thermal stress
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