A Novel Superconducting Interconnection for Superconducting MCM Using Wire Bonding Method with Pb-In Alloy

international conference on electronic packaging technology(2020)

引用 0|浏览21
暂无评分
摘要
In this paper, a novel superconducting interconnection method in SFQ MCM is introduced. The lead- indium alloy solder wire (Pb25In75) was used to achieve wire bonding on the niobium pad by ultrasonic bonding. Then the tensile test was carried out and superconducting properties was measured by means of Kelvin Four-terminal method. The results showed that it has high tensile strength and superconducting properties at 4.98K, achieving a superconducting interconnection, and that a good contact between lead-indium wire and niobium pad is realized.
更多
查看译文
关键词
Superconducting interconnection,Wire bonding,Lead-indium (Pb-In) alloy,Multichip Module (MCM),SingleFlux-Quantum (SFQ)
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要