Preliminary design of a novel AlN-Al composite coating used for micro-electronic packaging via finite element modeling

Guangshu Li,Chaohui Wang,Huanyu Zhang,Mingxiang Zhuang,Zhongchao Hu, Yao Liu,Liang Wang

Materials Letters（2020）

引用 8|浏览11

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摘要

•A novel AlN-Al composite coating is proposed.•A new idea to create a buffer layer between encapsulating material and the chip.•The coefficient of thermal expansion of the AlN-Al composite coating is changeable.•AlN-Al composite coating with high thermal conductivity was obtained.

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关键词

AlN-Al,Coating,Encapsulating material,Thermal properties,Finite element simulation,Ceramics

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