Panel Packaging Approach To Micro Thin-Film Battery Sealing For Healthcare And Internet Of Things (Iot) Applications

Qianwen Chen,Bing Dang,Leanna Pancoast,Jae-woong Nah,John Knickerbocker,Andy Shih, Bo Wen Cheng,Kai Liu,Mengnian Niu,Simon Nieh

2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020)（2020）

引用 1|浏览14

暂无评分

摘要

In this work, a panel packaging approach based on programmable laser milling, injection molded soldering (IMS), and temporary handling technologies has been proposed and demonstrated for micro thin-film-battery (TFB) cells. Micro TFB cells in the dimensions of 2.5mm x 2.5mm x 0.1mm have been successfully packaged and sealed with overmolding solder.

查看译文

关键词

Programmable laser milling, Injection molded soldering (IMS), Temporary handling, Healthcare, IoT, Solid State Thin Film Battery, Medical Device, Implantable Introduction

AI 理解论文

溯源树

样例

生成溯源树，研究论文发展脉络

Chat Paper

正在生成论文摘要