Interposing Of Microelectronics By Micro Transfer Printing To Create 3-D Structures

Micro transfer printing (mu TP) is a useful method for heterogenous integration of micro-scale devices but typically requires additional electrical interconnection of devices following print. In this paper, the concept of interconnect at print is explored and a stacked configuration demonstrating electrical interconnection of 3-D micrometer scale electrical devices is shown. Structures that are 45 mu m by 25 mu m consisting of four metallized spikes on the bottom and recessed pyramids at the top are stacked, probed, and shown to illuminate light demonstrating their electrical interconnection from print.