Active Antenna Subsystem Integration Of Steerable Boresight Radiation Beams For 5g Millimeter Wave Applications By System-In-Packaging Process

In this paper, an active antenna-in-package (AiP) design at millimeter wave frequencies (mmW) is presented for user equipment (UE) and customer-premises equipment (CPE) applications. In particular, the UE and CPE AiP implements 4 4 and 6 6 microstrip antenna elements on the stacked substrates of conventional system-in- package process to realize the desired gains for 5G applications. Within a 19 x 19 mm(2) area, we are able to achieve -10 dB reflection coefficient bands of 24.25-29.5 and 37-43.5 GHz by simulations for the two most popular 5G frequency bands, where the simulated gains are 13.7 and 15.22 dBi, respectively. The beam scan range is up to +/- 40 degrees. On the other hand, the CPE AiP is designed on a 33 x 33 mm(2) area, where the maximum gains are 18.83 and 21.25dBi at 28 and 39 GHz, respectively.