Recent progress in 1.3-and 1.5-mu m waveband wafer-fused VCSELs

A. Mereuta, A. Caliman, A. Sirbu,V. Iakovlev,D. Ellafi,A. Rudra,P. Wolf,D. Bimberg, E. Kapon

Proceedings of SPIE(2016)

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摘要
The progress of 1.3- and 1.5-mu m waveband wafer-fused VCSELs is reported. The emission of single mode power of 6 - 8 mW at room temperature and up to 3 mW at 80 degrees C were demonstrated. 10-Gb/s full wavelength-set VCSEL devices for CWDM systems with high yield and Telcordia-reliability were industrially manufactured. By increasing the compressive strain in the QWs and reducing the cavity photon life time the modulation bandwidth was increased to 11.5 GHz, and large-signal data transmission experiments show error-free operation and open eye diagrams from 25 to 35 Gb/s in both B2B and after 10-km, respectively.
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关键词
Long wavelength VCSELs,Optoelectronic Devices,Wafer-Fusion,MOVPE,Data Communications
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