Film Stress of Microshutter Arrays for the James Webb Space Telescope

M. J. Li, T. Adachi, C. A. Allen,S. R. Babu,S. Bajikar, M. A. Beamesderfer, R. Bradley,N. P. Costen,Kevin Denis,A. J. Ewin,D. Franz, L. Hess, R. Hu, K. Jackson,M. D. Jhabvala, D. Kelly,T. King,G. Kletetschka,A. S. Kutyrev, B. A. Lynch, S. E. Meyer, T. Miller,S. H. Moseley,V. Mikula,B. Mott, L. Oh, J. T. Pontius, D. A. Rapchun, C. Ray,S. Schwinger,P. K. Shu,R. Silverberg, W. W. Smith, S. Snodgrass, D. Sohl,L. Sparr, R. Steptoe-Jackson, R. J. Thate, F. Wang, L. Wang,Y. Zheng,C. Zincke

2008 Solid-State, Actuators, and Microsystems Workshop Technical Digest（2008）

Cited 16|Views4

Key words

micro-optics,near infrared,space telescope,indium bump bonding,packaging,microshutter,MEMS,DRIE

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