Low Temperature Direct Bonding 3D Stacking Technologies for High Density Device Integration

L. Di Cioccio,I. Radu,G. Gaudin,T. Lacave,F. Baudin,M. Sadaka,T. Signamarcheix

ECS Transactions（2013）

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摘要

3D integration aims at providing highly integrated systems by vertically stacking and connecting various materials, technologies, and functional components together. We will review the different approaches, using direct bonding, developed to address 3D devices manufacturing challenges.

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