Architecture, Dataflow and Physical Design Implications of 3D-ICs for DNN-Accelerators

2021 22nd International Symposium on Quality Electronic Design (ISQED)(2021)

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摘要
The everlasting demand for higher computing power for deep neural networks (DNNs) drives the development of parallel computing architectures. 3D integration, in which chips are integrated and connected vertically, can further increase performance because it introduces another level of spatial parallelism. Therefore, we analyze dataflows, performance, area, power and temperature of such 3D-DNN-acce...
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关键词
Three-dimensional displays,Temperature,Stacking,Computer architecture,Parallel processing,Thermal conductivity,Thermal analysis
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