Study on the Softening Behavior of Cu-Cr-In Alloy during Annealing

The softening behavior of a cold-drawn Cu-Cr-In alloy was investigated during annealing between 450 degrees C and 700 degrees C. The properties and microstructure evolution of the alloy were characterized using a microhardness tester, electron back-scatter diffraction, and transmission electron microscopy. Elemental In addition was found to hinder the dislocation movement and delay the recovery and recrystallization of the Cu-Cr-In alloy. The experimental data were analyzed using the Johnson-Mehlv-Avramiv-Kolmogorov model. The activation energy of recrystallization of the 60% cold-drawn Cu0.54Cr0.17In alloy was 188.29 +/- 18.44 kJ/mol, and the recrystallization mechanism of the alloy was attributed mainly to Cu self-diffusion.