Designing Carbon Nanotube Interconnects for Radio Frequency Applications

With the blooming demand for wireless and mobile applications, the needs to develop existing RF technologies are increasing. For example, there is a need for RF technologies that can operate at much higher frequencies, which can be potentially used for satellite or tetra-hertz imaging applications. Thus, there is a strong interest for novel materials, which can have more reliable and stable high-frequency performance. Flip chip is one of the technology offering lower insertion loss, compact packages, and low-cost fabrication. The use of carbon nanotube (CNT) bumps to replace existing materials or applications is not unheard of. In this chapter, demonstration of a successfully CNT flip chip device at high frequency will be done. A parametric study using hybrid EM/analytical modeling of the device will be conducted.