THE CONDUCTIVE ADHESIVE JOINS UNDER THERMAL SHOCKS

The work is focused on joins realised by electrically conductive adhesives. Electrically conductive adhesives are used as alternative to soldering technology. Lower curing temperature is main advantage of adhesives. But electrical and mechanical parameters are worse than for solders. Investigation of electrically conductive adhesives with added nanoparticles is realized to try improvement of their electrical and mechanical properties. The influence of thermal shocks on properties of joins realized by electrically conductive adhesives were analyzed. The temperature during thermal ageing is changed from room temperature to temperature below freezing point. Electrical resistance and non-linearity of current voltage characteristic were measured. Mechanical strength was measured too.